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Part 1: Document Description
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Citation |
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Title: |
JART TC |
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Identification Number: |
doi:10.26165/JUELICH-DATA/AHUQHC |
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Distributor: |
Jülich DATA |
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Date of Distribution: |
2025-03-26 |
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Version: |
1 |
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Bibliographic Citation: |
Schön, Daniel; Menzel, Stephan, 2025, "JART TC", https://doi.org/10.26165/JUELICH-DATA/AHUQHC, Jülich DATA, V1 |
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Citation |
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Title: |
JART TC |
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Subtitle: |
Thermal Crosstalk in RRAM Memory Array |
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Identification Number: |
doi:10.26165/JUELICH-DATA/AHUQHC |
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Authoring Entity: |
Schön, Daniel (Peter Grünberg Institut (PGI-7)) |
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Menzel, Stephan (Peter Grünberg Institut (PGI-7)) |
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Distributor: |
Jülich DATA |
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Access Authority: |
Schön, Daniel |
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Depositor: |
Schön, Daniel |
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Date of Deposit: |
2025-01-27 |
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Study Scope |
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Keywords: |
Computer and Information Science, Engineering |
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Abstract: |
Upcoming computing and market-ready storage technologies must not only become more powerful, but also more energy-efficient to meet future challenges. A promising solution are BEOL-integrated RRAM arrays. However, with shrinking feature size, thermal management is becoming increasingly important, especially with regard to temperature-accelerated switching. Here, we present a 3D electrothermal model of an 8x8 RRAM array based on a 40 nm RRAM process which is used to investigate the thermal effects on a selected device itself as well as on the adjacent RRAM cells. With the corresponding simulation tool, which can be downloaded here, various parameters can be varied and their influence on the thermal crosstalk analysed. This COMSOL App is available without (JART_TC.exe – 70 MB) and with (JART_TC_runtime.exe – 1271 MB) COMSOL runtime. In the first case, the download is significantly smaller and the COMSOL runtime will be automatically installed if necessary. |
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Methodology and Processing |
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Sources Statement |
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Data Access |
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Notes: |
CC0 Waiver |
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Other Study Description Materials |
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Related Publications |
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Citation |
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Identification Number: |
10.1109/IMW59701.2024.10536969 |
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Bibliographic Citation: |
D. Schön and S. Menzel, "Understanding the Thermal Aspects in Dense RRAM Memory Arrays," 2024 IEEE International Memory Workshop (IMW), Seoul, Korea, Republic of, 2024, pp. 1-4. |
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Label: |
JART_TC.exe |
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Text: |
COMSOL App without runtime |
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Notes: |
application/x-msdownload |
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Label: |
JART_TC_runtime.exe |
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Text: |
COMSOL App with runtime |
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Notes: |
application/x-msdownload |